“How to” Secure Piezoelectric Ceramics
APC helps explain the best way to secure a piezoelectric ceramic to a solid surface
To secure a piezo ceramic to a solid surface, you have three primary options: gluing, soldering, and clamping. Of the three options the best approach to secure a piezo element is typically with a glue or epoxy.
Using an epoxy or acrylate glue is the best option because it:
– Provides a strong, flexible, non-conducting bond
– Eliminates possible vibration induced fatigue during long-term operation
– Can be used at temperatures exceeding 150C.
Soldering can be ineffective over time because vibrations in the ceramic can cause the bond to fail and the high temperatures used when soldering can effect the properties of the ceramic.
The least reliable method to secure a piezo element to a solid surface is clamping due to the possibility of damaging the ceramic when securing it. Clamping can also restrict to the movement of the ceramic.
APC offers advice and suggestions for epoxies to use in the Technical Updates section of its website. Follow this link for more information on Epoxies for General Use with Piezoelectric Ceramics and Devices. If you have additional questions about securing piezo electric ceramics please contact a member of our engineering team.
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